PHIX ambition is to become the world’s first automated photonics assembly and packaging line for medium and large volume photonic integrated circuits (PICs), photonic components, assemblies and modules. PHIX will sell photonic components and assemblies, act as component or module manufacturer and subcontractor for OEM a Tier 1 customers and provide education and training on photonics assembly and packaging in collaboration with its academic partners. PHIX addresses the need for advanced photonic assembly and packaging solutions in a market that is expected to be worth over €615 billion by 2020. PHIX will provide a state-of-the-art infrastructure in The Netherlands, supporting the European and worldwide industrial development of Photonic Integrated Circuits (PICs). Currently PHIX employs nearly 10, highly educated people, and its management has experience in the micro/nano packaging technology for decades.
Role in the project
Within the project PHIX leads the component integration and assembly activities for the TERAWAY modules and nodes and is responsible as work package leader for the different packaging. During the project PHIX will develop the process for flip-chip integration of InP components and preparation of optical subassemblies, as well as the develop the packaging engine for the multi-chip modules.