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TeraWay

H2020 5GPPP Phase III project

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PHIX B.V. (PHIX)

March 31, 2020

PHIX ambition is to become the world’s first automated photonics assembly and packaging line for medium and large volume photonic integrated circuits (PICs), photonic components, assemblies and modules. PHIX will sell photonic components and assemblies, act as component or module manufacturer and subcontractor for OEM a Tier 1 customers and provide education and training on photonics assembly and packaging in collaboration with its academic partners. PHIX addresses the need for advanced photonic assembly and packaging solutions in a market that is expected to be worth over €615 billion by 2020. PHIX will provide a state-of-the-art infrastructure in The Netherlands, supporting the European and worldwide industrial development of Photonic Integrated Circuits (PICs). Currently PHIX employs nearly 10, highly educated people, and its management has experience in the micro/nano packaging technology for decades.

Role in the project

Within the project PHIX leads the component integration and assembly activities for the TERAWAY modules and nodes and is responsible as work package leader for the different packaging. During the project PHIX will develop the process for flip-chip integration of InP components and preparation of optical subassemblies, as well as the develop the packaging engine for the multi-chip modules.

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TERAWAY

“Terahertz technology for ultra-broadband and ultra-wideband operation of backhaul and fronthaul links in systems with SDN management of network and radio resources”

Call: H2020-ICT-2019-2
Topic: 5G Long Term Evolution
Type of Action: RIA
EU contribution: € 5.999.498,75
Duration: 36 months
Start date: 01.11.2019

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5G PPP
Photonics21
Horizon 2020

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This project has received funding from the European Union’s Horizon 2020 Research and Innovation Programme under G.A No 871668 and it is an initiative of the Photonics Public Private Partnership

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